System Architect at Kandou Bus

At

Kandou, we are redeﬁning the economics of AI infrastructure. Our mission is to democratise AI by signiﬁcantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption signiﬁcantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.We are actively seeking a System Architect based in US (Bay Area or Austin preferred), EU considered.

Own the SoC and Product Specification stack for a 1.6T retimer SoC and the AEC product it enables, at 224G/lane PAM4.
You will author and maintain normative specifications (SHALL/MUST/SHOULD/MAY language with REQ-ID traceability) that RTL, firmware, software, SI/PI, manufacturing, qualification, and customer engineering teams execute against.
Standards scope spans IEEE 802.3ck/dj, OIF CEI-112G/224G, OSFP MSA, CMIS 5.x, EIA-364, JEDEC JESD22/51.
You will represent architecture in hyperscaler and strategic platform customer specification negotiation, including qualification test point, FEC telemetry, CMIS vendor-page, and thermal envelope commitments.Required:
12+ years in shipping high-speed interconnect (retimer, gearbox, PHY, AEC, AOC, coherent optics, SerDes-centric networking silicon).
Prior System Architect, Chief Architect, or Principal Systems Engineer role on a shipping 100G/lane or higher product.
Direct authorship of at least one product spec and one silicon spec on a shipping product.
PAM4 link training, FEC, and on-die telemetry fluency at the specification level.
DOORS / JAMA / equivalent traceability tooling.

Life at Kandou Bus

Headquartered in Lausanne, Switzerland and founded in 2011, Kandou Bus is an innovative interface technology company specializing in the invention, design, license and implementation of unmatched chip-to-chip link solutions. Kandou's Chordâ„¢ technology lowers power consumption and improves overall performance of semiconductors, unlocking new capabilities in electronic devices and systems.

Thrive Here & What We Value

Dynamic Role within Kandou's Program Management Organization

Growing Product Portfolio with Increasing Importance of Software

Exciting Time for the Company

Multifaceted and Influential Role within Kandou

Breadth of Experience in Semiconductor Industry

High-tech scale-up with opportunities for growth and challenging work

Challenges are our drive, innovation our calling

Innovative leader in highspeed and energy efficient chip-chip link solutions critical to the evolution of the electronics industry

System Architect

Life at Kandou Bus

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