<2026 Internship Program> Process Engineer Intern (Wire Bonding) at NXP

To work with operation/maintenance to ensure production smoothly.
To assist action confirmations with system monitors.
To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator.

Job Qualification:

Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures
Bachelor's or Master's student in Material/Science/Electronic Engineering or related
Available to work at least 3 days/week.
Good verbal and written English communication skills
MS Office or Programming skill
Self-motivated, results oriented, willing and eager to learn, proactive attitude

More information about NXP in Greater China...#LI-2370

Life at NXP

At NXP, our goal is to provide you with environmentally preferred products that meet both regulatory requirements and your specific restrictions on hazardous substances and minerals. Our global Environmental Compliance Organization (ECO) manages our corporate product compliance procedures for:

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Enabling the best software experience through MCUXpresso tools

Combining extensive embedded system expertise with modern technologies

International team using agile techniques

Fast-paced, innovative environment

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Crossindustry community for car networking novelties

Attractive compensation package (including pension plan and company benefits)

Flexible working hours and home office options

Investment in career enhancement through skill building

Support for family challenges

<2026 Internship Program> Process Engineer Intern (Wire Bonding)

Job Qualification:

Life at NXP

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