Packaging Engineer

Challenges are our drive, innovation our calling. We at Kandou are a team of passionate accomplished professionals making a mark in the semiconductor industry. We're an innovative leader in high-speed and energy-efficient chip-chip link solutions critical to the evolution of the electronics industry, continuously developing to meet the demands of not just the customers of today, but tomorrow too. If you love to be a part of high-tech scale-up and are motivated by pushing your limits and challenging the status quo, we have an opportunity for you.

• Authority in all stages of assembly manufacturing
• Promotion of Design for Manufacture (DFM) philosophy within Kandou Bus

• Ownership of package technology selection and design in accordance with Kandou products requirements

• Ownership of substrate design for substrate-based products e.g. TFBGA, LFBGA, FCCSP, etc.

• Transfer of product performance, quality, and customer requirements into various design and or assembly specifications/procedures

• Ownership of all packaging documentation/maintenance along with implementation of relevant specifications at Kandou’s packaging partners

• Bring up and management of assembly partners in line with Kandou’s product realization process ensuring qualification, early volume, and sustaining engineering

• Work with multi-functional groups including product design, engineering, and marketing to ensure our package technology requirements are fully supported by Kandou’s assembly partners.

• Review package technology offerings and Kandou’s product requirements driving understanding and alignment with Kandou’s technology roadmap

• Drive accountability and awareness, solve problems, remove roadblocks, and proactively search out and address risks or weaknesses to ensure new product requirements meet quality standards and NPI completes on time and within budget

• Provide silicon leadership driving initiatives including time to market, yield, quality & cost

• Specifies assembly/packaging partners

• Improves assembly production performance through monthly metrics, quarterly business reviews and comprehensive supplier assessments

• Prepares analysis presenting data analysis to management and customers where required

• Assures supplier understanding of production requirements

• Maintains required documentation and files

• Advanced skills with all MS Office Products, especially Excel and PowerPoint
• Used to working in a commercially driven organisation as part of a Product Development and Operations team

• Able to work to tight and variable time scales

• Ability to plan and manage own workload and that of others

• Strong diagnostic and analytical skills with excellent numerical ability

• Confident communicator with excellent presentation skills.  Spoken & written English proficiency is a must.

• Good networking, negotiation and influencing skills

• Candidate must possess hands-on experience, has demonstrated leadership, communication, and influencing skills and is able to communicate with ease with customers, Senior Management and all Kandou groups
• +5 years semi-conductor industry experience essential with knowledge of manufacturing processes, procedures, facilities and equipment

• +5 years’ experience of working with fabless silicon operations

• +5 years’ experience of working with outsourced assembly packaging partners

• Knowledge of continuous improvement and structured problem solving such as 8-D, fishbone, and other tools

• Extensive experience in effective collaboration with design, development and manufacturing organizations particularly relating to design for manufacture

• The successful candidate will own all packaging engineering activities at Kandou. A minimum of 5 years of recent experience working in the semiconductor industry, is a 
• Bachelor’s degree or equivalent in any of the following is a requirement: Electrical Engineering, Mechanical Engineering, Materials & Manufacturing Processes or similar