Roles and Responsibilities
- Responsible for Quality, Yield, Cost and Productivity improvement activities related to Pre-Assembly and Die Attach process in RF Assembly
- Partner with manufacturing and equipment team to support delivery, work on daily production line issues, drive quality and operational excellence
- Responsible for process yield improvements and LOH reduction through systemic problem solving and identifying solutions to baseline issues
- Collaborate with API for Pre-Assembly and die attach process and material optimization
- Partner with supplier, vendor, procurement to work on productivity and cost improvement projects for the operation
- Support NTI/NPI qualification, apply lesson learnt and ensure smooth transition to high-volume manufacturing
- Responsible for FMEA, Control Plan, OCAP and SWE as documentation owner and to drive enhancement and compliance
- Work on strategic industrialization plan, automation and quality firewall implementation
- Collaborate with cross functional team to improve manufacturing robustness and process stability
- Support internal and external audit, drive compliance to requirements
Profile
- Bachelor’s Degree in Engineering Discipline (Material Science/Electrical/Mechanical or equivalent)
- 3-6 years of working experience in Semiconductor industry with hands-on experience in Die Sort, Stealth Dicing, SMT, Die Attach, AOI is an added advantage
- Knowledge on SPC, Process Control, Statistics and DMAC problem-solving skills would be preferable
- Good knowledge in material science especially metallurgy
- Technically competent, data driven and hands-on with strong analytical thinking and good in problem solving
- Has the desire to learn, take up new challenges, consistently challenge status quo and eager to strive for success
- Strong interpersonal skills, a good team player with ability to work independently and resourceful
- Able to multi-tasks, work under pressure and tight dateline and comfortable working in a fast-paced environment
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